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RMT-B120A/B119C/ B119P/ B119A/B119T
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Laser: Semiconductor laser
( Jack name:
Jack type/Output level/Load impedance)
Jack type/Output level/Load impedance)
Phono jack/0.5 Vp-p/75 ohms
HDMI 19-pin standard connector
100BASE-TX Terminal
BDP-S1100/BX110 (Basic)
USB jack Type A, maximum current 500 mA (For connecting USB device)
USB jack Type A (For connecting a USB memory,memory card reader,
digital still camera, and digital video camera)
digital still camera, and digital video camera)
Wireless (BDP-BX310/S3100 ONLY)
Wireless LAN standard:
Wireless LAN standard:
Frequency range:
2.4 GHz band : Channels 1-11 : US,CND / Channels 1-13 : Other
DSSS and OFDM
This product meets ENERGY STAR® guidelines for energy
effi ciency. ENERGY STAR and the ENERGY STAR mark
are registered U.S. marks. ENERGY STAR is a registered
mark owned by the U.S. government.
(BDP-S1100/BX110/S3100:US,CND/BX310)
effi ciency. ENERGY STAR and the ENERGY STAR mark
are registered U.S. marks. ENERGY STAR is a registered
mark owned by the U.S. government.
(BDP-S1100/BX110/S3100:US,CND/BX310)
220 – 240V AC, 50/60Hz (BDP-S1100:UK,AUS,AEP,CH,RUS/S3100:UK,AUS,AEP)
110 – 240V AC, 50/60Hz (BDP-S1100:E,MX,EA,KS,IN,PX,SP,TH,CL,BR/
S3100:E,MX,CL,BR)
120V AC, 60Hz (BDP-S1100/S3100/BDP-BX110/BX-310:US,CND)
110V AC, 60Hz (BDP-S1100:TW)
110 – 240V AC, 50/60Hz (BDP-S1100:E,MX,EA,KS,IN,PX,SP,TH,CL,BR/
S3100:E,MX,CL,BR)
120V AC, 60Hz (BDP-S1100/S3100/BDP-BX110/BX-310:US,CND)
110V AC, 60Hz (BDP-S1100:TW)
8.8 W (BDP-S1100/ BX110)
9.9 W (BDP-S3100/ BX310)
9.9 W (BDP-S3100/ BX310)
290mm × 199mm × 43mm
(11 (1/2) in. × 7 (7/8) in. × 1 (3/4) in.)
(width/depth/height) incl. projecting parts
(11 (1/2) in. × 7 (7/8) in. × 1 (3/4) in.)
(width/depth/height) incl. projecting parts
1.1 kg (2 lb 7 oz)
5ºC to 35ºC(41ºF to 95ºC)
25 % to 80 %
• High Speed HDMI cable (1)
(BDP-BX110/BX310:US,CND/
S1100:CH,E,MX,EA,KS,IN,SP,TH,CL,TW,BR/S3100:E,MX,CL,BR)
• LAN cable (1) (BDP-S1100: TW)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
Specifi cations and design are subject to change without notice.
(BDP-BX110/BX310:US,CND/
S1100:CH,E,MX,EA,KS,IN,SP,TH,CL,TW,BR/S3100:E,MX,CL,BR)
• LAN cable (1) (BDP-S1100: TW)
• Remote commander (remote) (1)
• Size AA (R6) batteries (2)
Specifi cations and design are subject to change without notice.
2013C6900-1
Published by Document Design Dept.
Sony Corporation
9-890-795-12
Remote : RMT-B119A
SERVICE MANUAL
AEP Model
Australian/NZ Model
Chile Models
BDP-S1100/S3100
Russian Model
Thailand Model
Taiwan Model
Middle East Model
BDP-S1100
Canadian Model
BDP-S1100/BX110/S3100/BX310
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
is 0.75V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples of a
passive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2V AC range are suitable. (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
and bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to
the customer and recommend their replacement.
the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration. Point them out of the customer and recommend
their replacement.
their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
leakage as described below.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
safety checks before releasing the set to the customer:
μ
Fig. A. Using an AC voltmeter to check AC leakage.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
Unleaded solder has the following characteristics.
Unleaded solder melts at a temperature about 40°C higher than
Unleaded solder melts at a temperature about 40°C higher than
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
Sony Bdp-s1100 Manual Online
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
as on IC pins, etc.
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
The use of optical instrument with this product will increase eye
hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
This label is located on the laser
protective housing inside the
enclosure.
protective housing inside the
enclosure.
WHEN SERVICING, DO NOT APPROACH THE LASER
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS
NECESSARY TO CONFIRM LASER BEAM EMISSION,
BE SURE TO OBSERVE FROM A DISTANCE OF MORE
THAN 25 cm FROM THE SURFACE OF THE OBJEC-
TIVE LENS ON THE OPTICAL PICK-UP BLOCK.
product. The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
MARKING is located on the rear exterior.
COMPONENTS IDENTIFIED BY MARK
MARK
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
COMPONENTS WITH SONY PARTS WHOSE PART
NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLE-
MENTS PUBLISHED BY SONY.
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
For customers in China
BDP-S1100/BX110/S3100/BX310
Title.
TABLE OF CONTENTS
1.1 Disc Removal Procedure If The Tray
Cannot Be Ejected (Forced Ejection) ................................. 1-1
1-2. Work when optical device are replaced .........................1-1
1-3. Test Disc .................................................1-2
1-3-1. Operation and Display ......................................1-2
1-3-2. Menu functions ...........................................1-9
1-4. Drive Repairing ..........................................1-15
1-4-1. Preparation .............................................1-15
1-4-2. Checking Flow ~ Drive (BU) section ~ .......................1-15
1-4-3. BU Check Flow [zz] ~.....................................1-16
1-4-4. BU (Optical Block) Repair Guide ............................1-16
1-4-5. BU Adjustment Flow [yy] ~ ................................1-17
1-4-6. KEM-480AAA/C2RP1 Packing Spec .........................1-17
Sony Bdp-s1100 Manual
1-4-7. BU Data Decode Jig ......................................1-18
1-4-8. Loading For Service ......................................1-19
1-4-9.Laser Caution Label .......................................1-19
1-4-10.In case of BU assy replacement .............................1-20
1-4-11.Fact fi nding .............................................1-20
1-4-12.New service method ......................................1-20
1-4-13.BU Data ...............................................1-20
1-5. Assembly Caution ........................................ 1-21E
2-1. Disassembly Flow ............................................... 2-1
2-2. Top Panel And Tray Cover Assy .................................... 2 -1
2-3. Front Panel, Fr-1001 Board And Wlan Module ......................... 2-2
2-4. Switching Regulator And Mb-1007 Board ............................. 2-2
2-5. BD Drive ....................................................... 2-3
2-6. Circuit Board Location ...........................................2-3E
2-2. Top Panel And Tray Cover Assy .................................... 2 -1
2-3. Front Panel, Fr-1001 Board And Wlan Module ......................... 2-2
2-4. Switching Regulator And Mb-1007 Board ............................. 2-2
2-5. BD Drive ....................................................... 2-3
2-6. Circuit Board Location ...........................................2-3E
3-1. Frame Harness ................................................. 3-1
3-2. Overall Block Diagram ............................................ 3-2
3-5. Power Block Diagram ............................................3-3E
3-2. Overall Block Diagram ............................................ 3-2
3-5. Power Block Diagram ............................................3-3E
4-1. This Note Is Common For Printed Wiring Boards ....................... 4-1
4-2. FR-1001 Board (FRONT RIGHT) Printed Wiring Board .................. 4-2
4-4. MB-1007 Board(MAIN) Printed Wiring Board (Side A) .................... 4-3
4-5. MB-1007 Board (MAIN) Printed Wiring Board (Side B) ..................4-4E
4-2. FR-1001 Board (FRONT RIGHT) Printed Wiring Board .................. 4-2
4-4. MB-1007 Board(MAIN) Printed Wiring Board (Side A) .................... 4-3
4-5. MB-1007 Board (MAIN) Printed Wiring Board (Side B) ..................4-4E
5. SERVICE MODE AND ERROR LOG LIST .......... 5-1
6. TROUBLESHOOTING .......................... 6-1
7-1. Exploded
...........................................7-1
7-1-1. Case Section .............................................7-1
7-1-2. Main Chassis Section ......................................7-2
7-1-3. BD Section ..............................................7-3
7-1-4. Accessories ............................................. 7-4E
BDP-S1100/BX110/S3100/BX310
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the side panel left. (Refer to page 2-1)
2. Insert a clip in the hole of a drive and open a tray.
2. Insert a clip in the hole of a drive and open a tray.
Sony Model Bdp S1100
1-2. Work when optical device are replaced
Sony Bdp S1100 Firmware
Note: Please do the following work when you replace the optical device.
1. Install it in PC after downloading two set of software from following URL.
(Refer to “1-4-8. BU Data Decode Jig” on page 1-19)
1
Microsoft .NET Framework Version 2.0 Redistributable Package (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=0856eacb-4362-4b0d-8edd-aab15c5e04f5
2
Microsoft .NET Framework 2.0 Service Pack 1 (x86)
http://www.microsoft.com/downloads/details.aspx?displaylang=en&FamilyID=79bc3b77-e02c-4ad3-aacf-a7633f706ba5
2. Take a photograph of the bar code on the optical device. The valid bar code photo as shown in Fig.2
3. Drag-and-drop the bar code photograph to the icon of decode software (BDPRdec).
* The decode software is a complete set of “BDPRdec”, “Tasman.Bars.dll”, and “SavePath”.
* Because decode software cannot be attached, it separately distributes it.
4. Input the password when you start decode software.
* Inquire of each service headquarters because the password cannot be disclosed.
(Refer to “1-4-4. BU (Optical Block) Repair Guide” on page 1-16 and “1-4-5. BU Adjustment Flow [yy]” on page 1-17)
1 Insert a clip in the hole of a drive
to open a tray.
to open a tray.
4